Chemical mechanical planarization - SIAD Società Italiana Acetilene e Derivati
Chemical mechanical planarization header
Chemical mechanical planarization
Semiconductor chemical mechanical planarization (CMP), the process of polishing silicon wafers, requires specialised and exacting products called slurries.
The objective of this process is to produce planar films on semiconductor wafers with low non-uniformity and excellent selectivity.
A wide variety of both standard and custom slurry products are used such as tungsten CMP products which offer advantages including easily dispersible suspensions, tight particle size distribution and uniform particle shapes.