Lead tinning header
Nitrogen is used to render inert the surface of a solder bath into which electronic components are dipped to coat the leads with solder.
Nitrogen prevents oxidation of the solder and gives a consistent, smooth coating. The benefits of lead tinning include:
- reduced icicles and or flags on the ends of leads
- faster wetting
- less bridging of leads on fine pitch components
- more consistent solder coat
- reduced dross production.