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Trichlorosilane, HSiCl3, is a colourless, toxic, flammable, corrosive liquid with a vapour pressure of 9.67 psia (6.7 kPa) at 70°F (21°C). It is shipped under nitrogen pressure of 20 psig (138 kPa).

In the semiconductor industry, trichlorosilane is used for:

  • epitaxial deposition of silicon, especially for thicker (>5 microns) layers where an abrupt transition profile and tight process control for film thickness are not critical.

Materials Compatibility
Metals: Brass; Stainless Steel; Carbon Steel; Monel.
Plastics: Kel-F; PTFE, FEP, and PFA Fluoropolymers resins; PVDF.
Elastomers: Viton.

Technical Properties
Molecular Weight: 135.5
Specific Gravity (Air=1): 4.7
Odour: Pungent, Suffocating
CAS Registry No.: 10025-78-2